chenwei810/Semiconductor_Manufacturing_Introduction

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AI 根据 README 整理 · 2026/10/18 17:06:39

目标用户

面向初学者，无需半导体物理背景；也提供了针对软件与固件工程师、封装与测试人员等不同角色的阅读路径。

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[](CONTRIBUTING.md) </div> An open, beginner-friendly book that follows one silicon wafer from sand, through the fab, test and packaging, until it becomes a chip. It skips heavy physics and focuses on process flow, terminology and know-how from the fab floor, with term boxes and know-how boxes in every chapter. No background in semiconductor physics is needed. --- ## 目錄 · Contents · 目次 · 목차 ### 第 0 部　開始之前 · Part 0: Before You Start · 第 0 部　はじめる前に · 제0부 시작하기 전에 | 章 | 繁體中文 | English | 日本語 | 한국어 |

| B | [現場行話](zh-TW/appendix/fab-jargon.md) | [Fab Jargon](en/appendix/fab-jargon.md) | [現場用語](ja/appendix/fab-jargon.md) | [현장 용어](ko/appendix/fab-jargon.md) | | C | [延伸閱讀](zh-TW/appendix/further-reading.md) | [Further Reading](en/appendix/further-reading.md) | [参考文献](ja/appendix/further-reading.md) | [참고 자료](ko/appendix/further-reading.md) | --- ## Reading paths | Path | Chapters | |---|---| | 🚀 Quick overview | 0, 1, 11, 14 | | 💻 Software and firmware engineers | 0, 2, 11, 13, 14, 22, 23, 24 | | 🏭 Joining the industry | The whole book, especially 1, 11, 15–18 and Appendix B |

使用方式

以在线书籍形式阅读，提供多语言版本，并可按章节顺序或根据推荐阅读路径浏览。

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<div align="center"> <img src="images/cover.svg" width="200" alt="A silicon wafer covered with dies"> # 半導體製造概論<br>Introduction to Semiconductor Manufacturing ## [繁體中文](zh-TW/README.md) ｜ [English](en/README.md) ｜ [日本語](ja/README.md) ｜ [한국어](ko/README.md) [](LICENSE)  

| B | [現場行話](zh-TW/appendix/fab-jargon.md) | [Fab Jargon](en/appendix/fab-jargon.md) | [現場用語](ja/appendix/fab-jargon.md) | [현장 용어](ko/appendix/fab-jargon.md) | | C | [延伸閱讀](zh-TW/appendix/further-reading.md) | [Further Reading](en/appendix/further-reading.md) | [参考文献](ja/appendix/further-reading.md) | [참고 자료](ko/appendix/further-reading.md) | --- ## Reading paths | Path | Chapters | |---|---| | 🚀 Quick overview | 0, 1, 11, 14 | | 💻 Software and firmware engineers | 0, 2, 11, 13, 14, 22, 23, 24 | | 🏭 Joining the industry | The whole book, especially 1, 11, 15–18 and Appendix B |

已知限制

作者声明内容基于公开信息和一般行业知识，不含任何公司的机密信息、工艺参数或内部流程，且多数数值为数量级或近似值。

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This book is based on public information and general industry knowledge. It contains no confidential information, process parameters or internal procedures of any company, and it is not affiliated with any semiconductor company. Most numbers are orders of magnitude or approximate values; actual values vary by process, product and company. ## License The text and images are licensed under [CC BY-NC-SA 4.0](LICENSE). You may share, adapt and translate them for non-commercial purposes, as long as you give credit and share your work under the same license.